Study on local recrystallization and damage mode of Lead-free BGA solder joint

摘要：

　　The compact and high-performance Lead-free BGA device has become the modern highly integrated device which is required in electronics assembly.In the course of service,they experience thermal cycling and become invalid.The failure mode of BGA device,which has undergone the thermal cycling,is investigated by scanning electronic microscope,electron back scattered diffraction and micro Vickers hardness tester.It concludes that the mismatch of the coefficient of thermal expansion between materials provides the driving force for the initiation and propagation of cracks which are along the grain boundaries of the local recrystallization weakened in the solder ball,and eventually the fracture of solder joint occurs.

关键词： BGA thermal cyclingt recrystallization

作者: Xing Xu Gaiqing Chen Mingsheng Cheng

作者单位: Engineering and Technology Department 38th Institute of China Electronics Technology Group Corporation Hefei,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 356-359

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）