Plasma Cleaning and Its application in Microwave Module Wire Bonding Technology

摘要：

　　Plasma cleaning process which can remove surface contamination from the electrode films on the circuit board becomes more and more important in the microwave module production,since it offers high bondability and reliability of wire bonding.The principle theory of plasma cleaning process was discussed in the paper,the optimal process parameters of plasma claening process were used to improve the wire bonding reliability.The results indicate that with proper process parameters,such as cleaning power and time,Au wire bonding reliability is improved obviously with plasma cleaning process,which can meet the demands of Au wire bonding technology used in hybrid integrated microwave modules.The study can provide refence for the ultrasonic Au wire bonding technology,the design of process control and process optimization in high density and high performance microwave module production.

关键词： microwave module plasma cleaning wire bonding

作者: Han Zongjie Yan Wei Hu Yongfang Li Xiaoxuan

作者单位: Nanjing Research Institute of Electronics Technology No.8,Guorui Road Nanjing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 360-362

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）