An Advanced Constitutive Model for SnPb and SnAg Solder Materials
Solder joint integrity is recognized as a key issue in the reliability of electronic devices.In the past decades,SnAgCu eutectic based solders are replacing SnPb eutectic solders in the electronics industry.Although the Pb-free solder is usually regarded as having a higher melting temperature compared with traditional Pb-Sn eutectic solder,solder joints were generally operated at a high homologous temperature,and exhibit complex rate-dependent behaviors.An advanced constitutive model for SnPb and SnAg solder materials is developed in this paper.A unified creep-plasticity constitutive law is adopted to simulate the complex inelastic behaviors of SnPb and SnAg solders.Damage during fatigue loading is predicted using continuum mechanics based method.The hardening of solders is considered combining both isotropic and nonlinear kinematic hardening.The developed model was incorporated into a finite element code.The mechanical properties and damage accumulation of both SnPb and SnAg solders were analyzed.Fatigue life under fully reversed cycling is investigated by monitoring the changing of peak stresses,which will decrease continuously due to damage accumulation.The numerical results were compared with experiment data and shows that the developed model can predict the stress-strain relationship and damage accumulation process of solder materials with reasonable accuracy.
solder creep plasticity damage finite element
Xu He Yao Yao
School of Mechanics and Civil Engineering Northwestern Polytechnical University Xian,China,710072
国际会议
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)
成都
英文
378-383
2014-08-12（万方平台首次上网日期，不代表论文的发表时间）