Large-scale production of oxidation-resistant Cu@SiO2 core shell nanoparticles for dielectric applications

摘要：

　　In this study,we report the large-scale fabrication of Cu@SiO2 nanoparticles with core-shell structure using a modified St(o)ber method.The obtained nanoparticles had an average particle size of 300 nm with SiO2 shell about 20 nm and exhibited excellent oxidation resistance and thermal stability in air atmosphere.PVDF based nanocomposites filled with pure Cu and Cu@SiO2 nanoparticles have been prepared by hot press method and their dielectric behavior was investigated.Compared with the Cu/PVDF composite,no typical percolation effect was observed in the Cu@SiO2/PVDF composite and when the content of Cu@SiO2 filler reached 20 vol%,the composite exhibited a high dielectric constant of 100 while maintained a low loss value of 0.1 at 1 kHz.Based on their excellent dielectric properties,core–shell Cu@SiO2 NPs are expected to be ideal fillers to develop polymer-based composites with high dielectric constant and low dielectric loss.

关键词： oxidation-resistant Cu@SiO2 core-shell nanoparticle percolation effect

作者: Gang Li Shuhui Yu Rong Sun

作者单位: Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences Shenzhen,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 384-387

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）