Solder Joint Reliability with Various Silver Finish on PCB

摘要：

　　Ag finish is a low cost and low resistant solution comparing with Au finish in electronic packaging.For the sake of application of Ag finish,the solder joint reliability with broad silver finish designs on PCB of packaging is studied.It is found that both finish structure and process affect the reliability.Electro-less Ni/Pd/immerging Ag(ENEPIS)has the best integrated solder joint performance in both thermal cycle test(TCT)and drop test.Immerging Ag finish has similar performance as OSP finish with good reliability in TCT and drop before aging.The TC reliability of electroplated Ag and drop reliability of electroplated Ni/Ag is poor because of voids associated with electroplating Ag process found at the interface of IMC and bulk solder.As for electro-less plated Ni/immerging silver(ENIS),the Ni-P layer is the weak point in drop test.

关键词： Silver Finish PCB Solder Reliability

作者: Liu Hai Jin Li Gu Liqun Li Juanjuan Li Ying Chen Qiang Du Maouha Zhou Jianwei Chang TaeSub

作者单位: Samsung Semiconductor(China)R&D Co.,Ltd No.15 Zhong Xin Avenue West,Suzhou Industrial Park,Suzhou,Jiangsu Province,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 396-400

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）