Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects

摘要：

　　The continuous downsizing of solder interconnect will significantly affect the wetting reactions between solder balls and pads and the cross-interaction of opposite heterogeneous pads,which further affects the reliability of the interconnect.In the present work,Cu/Sn-3Ag-0.5Cu/Ni-P solder interconnects with ball diameters of 200,300,400 and 500μm were reflow soldered to study the size effect and cross-interaction in the solder interconnects.It was found that(Cu,Ni)6Sn5 type intermetallic compounds(IMCs)formed on both Cu and Ni-P pads after soldering.The IMCs formed on the Cu pad had a scallop morphology and those formed on the Ni-P pad had a needle-type morphology.Meanwhile,cross-interaction occurred in all the Cu/Sn-3Ag-0.5Cu/Ni-P interconnects,i.e.,the Ni atoms that diffused from the Ni-P side to the Cu side refined the(Cu,Ni)6Sn5 at the solder/Cu interface; also,the Cu atoms diffused from the Cu side to the Ni-P side prevented the transformation of IMCs from(Cu,Ni)6Sn5 to(Ni,Cu)3Sn4 at the solder/Ni-P interface.Moreover,the grain size of(Cu,Ni)6Sn5 in the 200μm solder interconnect was larger than that in the 500μm solder interconnect at Cu side.

关键词： Size effect Cross-interaction Cu/Sn-3Ag-0.5Cu/Ni-P interconnect Interfacial reaction Intermetallic compound

作者: Mingliang Huang Fan Yang Ning Zhao Xiaohua Liu Jingyun Wang

作者单位: Laboratary of Electronic Packaging Materials School of Materials Science & Engineering,Dalian University of Technology Dalian,China 116024

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 429-432

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）