The effect of low-melting point alloy re-melting process on the quality of mixed BGA joint and its reliability

摘要：

　　In this paper,a serious crack phenomenon of Backward Compatible Assembled BGA joint with reflow and waving process was found and solved by the optimization of soldering process.The quality of BGA solder joints was confirmed after optimization.The mechanism of such cracking was illustrated.

关键词： mixed BGA joint low melting point alloy reliability cracking mechanism

作者: Hongqin Wang Zhonghua Wan Daojun Luo Zilian Liu

作者单位: The Fifth Research Institute of MIIT,P.R.China,Guangzhou,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 447-451

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）