Applications of Low Temperature Sintering Technology as Die Attach for High Temperature Power Modules

摘要：

　　Silver-based low temperature sintering technology(LTST)is becoming a promising alternative to bond or joint the large area joints as die attach for high temperature power modules.A review of the silver-sintered die attach technologies will be presented in this paper,as well as a roadmap of challenge of the state-of-the-art silver sintering.Then,highlighted are the methodology of sintering process,the different types and application of sintered Ag paste,the effects of the process parameters on the sintering layer,and the quality evaluations of sintered joints by means of destructive or non-destructive tests.Finally,the applications as well as challenges of silver sintering for high temperature power modules are proposed.

关键词： Low temperature sintering technology (LTST) silver sintering die attach DBC substrate power module high temperature

作者: Yibo Wu Yimin Zhao Yangang Wang Steve Jones Xiaoping Dai Guoyou Liu

作者单位: Power Semiconductor R&D Centre(Dynex Semiconductor Ltd)Zhuzhou CSR Times Electric Co.Ltd.Doddington Road,Lincoln LN6 3LF,United Kingdom

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 452-457

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）