Effect of CuO on laser absorption in glass to glass laser bonding

摘要：

　　localized laser bonding using a glass frit intermediate layer is an ideal technology to hermetically package miniature devices without heating the function components.It is important to describe the laser energy transmission and absorption in glass frit when modeling heat transfer in transmission laser bonding of glass to glass.Excess energy leads to over-burning of the glass material and deficit energy produces weak bonding.In this paper,the effect of CuO as additive in glass frit is investigated.The research shows that the content of CuO is confirmed to have direct influence on the laser absorption and the bonding quality.Shear force test,SEM and EDX analysis are used to survey the bonding quality.After a series of experiment and analysis,we found that adding 15%CuO can get a best result of encapsulation.Within the scope of this add,the glass frit could meet the needs of packaging.

关键词： TLB glass to glass laser bonding absorptivity of laser

作者: Kui Fu Yi Li Luqiao Yin Jianhua Zhang

作者单位: School of Mechatronics and Automation,Shanghai University;Key Laboratory of Advanced Display and System Applications(Shanghai University),Ministry of Education Shanghai University Shanghai,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 484-488

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）