Simulation on heat transfer of microchannels and thermal vias for high power electronic packages

摘要：

　　The heat transfer characteristic of cooling microchannels and thermal vias integrated in low temperature co-fired ceramic(LTCC)multilayer electronic packaging substrate have been investigated by finite volume simulation method,including straight,spiral and I-shaped fractal microchannels.The width of microchannel is 200 microns and the height is about 186 microns.The side length of Cu thermal via is 0.1,0.2,0.5 and 1 mm with the amount of about 100.The water mass flow rate at the inlet was controlled at 45 ml/min and a high power chip of 100 W was supplied at the center of LTCC surface.The heat transfer behaviors were characterized by the decrease of maximum working temperature and temperature distribution of heating chip surface.It is found that the spiral microchannel with 1 mm thermal vias has the best cooling ability and the maximum temperature is reduced to 74.84℃.The adding of cu vias has great enhancement on the heat transfer by reducing the maximum temperature over 10%.The heat distribution of heating area is significantly improved due to the high speed of heat transfer from the chip to the cooling microchannels by high thermal conductive of Cu via.

关键词： Heat transfer LTCC Microchannel Thermal Via Temperature field

作者: Lan-Ying Zhang Yang-Fei Zhang

作者单位: Department of Materials Science and Engineering,College of Engineering,Peking University Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 508-510

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）