Effect and Experiment of Screw Locations on BGA Viscoplastic Fatigue Life

摘要：

　　This paper establishes a packaging module of multichip with lead-free solder ball SAC305.BGA solder ball adopt nonlinear Anand viscoplasticity constitute formula.With the change factor of five screw locations,the dangerous solder ball position and stress-strain hysteresis curve are obtained through simulation with applying thermal cycling condition and screw prestress under the IPC9701 standard.Based on Coffin-Manson equation,the fatigue life of dangerous solder ball and the trend curve of solder ball life with the screw locations are deduced.And through experiments,the conclusion of the simulation is verified.

关键词： BGA thermal cycling screw locations fatigue life solder ball life

作者: Tian Wenchao Guan Rongcheng

作者单位: School of Electro-Mechanical Engineering Xidian University Xian,710071,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 529-534

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）