Fatigue LifePrediction for CBGA under Random Vibration Loading by Finite Element Method

摘要：

　　In recent years,the reliability under vibration loading has become a very important problem of modern electronic devices.And existing researches have shown that the results of natural frequencies and modal shapes by FEA(Finite Element Analysis)fit that of modal test well.But it is challengeable to execute the vibration fatigue life analysis rapidly and accurately.In this paper,a predict method of fatigue life was used to calculate the random vibration life of CBGA,and the 1:1 finite model was built to obtain relevant data.And the results showed that the outmost corner solder balls were observed to have stress concentration along the interface by using the von Mises stress distributions of solder balls.So the outmost corner solder balls are the dangerous area and their random vibration life can be considered as whole devices life.Through the methods,the random vibration life was obtained and the CBGA model showed a better performance under vibration loading.

关键词： CBGA life prediction random vibration

作者: Shang Wang Yanhong Tian Xuguang Guo

作者单位: State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology HIT Harbin,PR China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 535-537

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）