Analysis of the Influence of SOP Lead Shape on Solder Joint Reliability

摘要：

　　3-D finite element models of SOP(Small Outline Package)were constructed,in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint.The solder joint deformation and stress distribution with five kinds of lead shapes were researched.The experimental program for the identification of numeri3cal simulation was performed with three kinds of lead shapes.Both experimental and simulation results showed that the solder joint life is closely related with lead shape.The lead shape with low stiffness can decrease the stress apparently.With decreasing the bending radius or increasing the standoff height,the component reliability will be enhanced.The numerical simulation result was congruous with experimental testing data,can able to reflect the factual behavior of SOP accurately.

关键词： lead shape finite element method SOP reliability

作者: Ren Chao Zeng Chenhui Shao Jiang Xue Heping Xu Wenzheng

作者单位: China Aero Poly-technology Establishment,CAPE Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 538-541

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）