Electrical Simulation of Thin Film Inductors on Silicon and Glass Substrates

摘要：

　　Passive devices are widely used in all kinds of systems.Generally,most of the passive components in an electronic system are assembled as discrete components or passive arrays.But a discrete passive component occupies a lot of space for the realization of its function.To overcome this shortcoming,one promising way is the integration of passive components into system in package.In this paper,we designed two kinds of thin film spiral inductors on both silicon and glass substrates.One is monolayer structure and,another has double layers.The inductors were modeled and simulated using Finite Element Method(FEM).And,the electrical analysis was performed by ANSYS HFSS and Q3D.

关键词： thin film electronic packaging technology passive component glass substrate thin film spiral inductor

作者: Zheng QIN Cheng PANG Xiaoli REN Wenya SHANG Dongkai SHANGGUAN Daquan YU

作者单位: University of Chinese Academy of Science;Institute of Microelectronics,Chinese Academy of Sciences;N Institute of Microelectronics,Chinese Academy of Sciences;National Center for Advanced Packaging National Center for Advanced Packaging University of Chinese Academy of Science;National Center for Advanced Packaging Institute of Microelectronics,Chinese Academy of Sciences

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 555-559

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）