Studies on Thermally Strain Relieving Behavior of Ring Configurations for a Packaged SAW Device Chip

摘要：

　　With the growing of the applications of surface acoustic wave(SAW)devices,the requirement for the accuracy of the operating frequency of the SAW devices is constantly strengthened.The impact of thermal strain on the characteristics of SAW devices cannot be ignored,which induced in their packaging process.In this paper,by using the finite element method(FEM)software,the thermal strain induced in the F-11 package structure of a SAW device is analyzed.An approach to reduce the thermal strain induced in the device chip by setting a ring configuration around it is explored.And the effects of various ring structures with different materials,thicknesses,widths and other parameters for reducing the thermal strain on the chip surface are analyzed and compared.

关键词： SAW packaging effect thermal strain finite element method

作者: Deyang Yan Wei Xu Lei Chen Cheng Zhao Yao Liang Liwang Jiang

作者单位: School of Physics Science and Technology Yangzhou University Yangzhou,225002,China Yangjie Electronic Technology Co.,Ltd Yangzhou,225008,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 596-598

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）