Electrical Characterization and Analysis on the Via-Solder Ball Structure

摘要：

　　With the increasing of operating frequency,parasitic parameters of packaging have significant effects on the performance of integrated circuits.Signal paths in packaging bring great transmission loss,especially discontinuous interconnections.In this paper,de-embedding methodology is used to extract S-parameter of via-solder ball structures.A typical test structure is designed,which consists of two 6-layer organic substrates that are vertically stacked by employing BGA interconnections.The results show that the insertion losses of via-solder ball with the diameter of 500μm and 600μm are below 3dB when frequency increases up to 10GHz.But for 760μm via-solder ball structure,the frequency range of 0 to-3dB insertion loss is DC to 7.5GHz.It can be seen clearly that the insertion loss increases with the increase of the diameter of solder ball.Through this work,we have a better understanding of the electrical characteristics of via-solder ball structure.And it can provide a direct reference for signal transmission path design.

关键词： de-embedding via-solder ball structure S parameter

作者: Yi He Jun Li Fengman Liu Peng Wu Liqiang Cao

作者单位: National Center for Advanced Packaging Wuxi City,Jiangsu,China;Institute of Microelectronics of Chinese Academy of Sciences Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 615-617

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）