Thermal Performance Investigation of Three-dimensional Structure Unit in Double-sided Cooling IGBT Module

摘要：

　　In order to improve the heat dissipation performance of IGBT module,a new type of structure unit for Three-dimensional IGBT module packaging which can implement double-sided cooling has been built.In view of the traditional single-sided cooling structure unit of IGBT module and the new type of Three-dimensional structure unit in double-sided cooling IGBT module,a corresponding mathematical model of heat dissipation of the structure has been deduced.The heat dissipation performances of the two models are calculated under the condition of the steady state heat conduction.Moreover,simulation calculation of heat conduction model has been carried out by ANSYS software.Result shows that under the same thermal boundary condition,heat dissipation performance of the double-sided cooling structure unit for Three-dimensional IGBT module package has improved by 47.5%compared with the traditional single-sided cooling structure unit of IGBT module package.

关键词： IGBT Double-sided cooling Three-dimensional structure unit Steady-state conduction FEM

作者: Chunlei Wang Libing Zheng Li Han Huachao Fang Ju Xu

作者单位: Chinese Academy of Sciences Beijing Engineering Laboratory of Electrical Drive System & Power Electr Chinese Academy of Sciences Beijing Engineering Laboratory of Electrical Drive System & Power Electr

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 622-625

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）