Packaging and process optimization for Three-dimensional structure unit of Double-sided cooling IGBT module

摘要：

　　Double-sided cooling IGBT module is a kind of package structure which can increase the power density effectively,improve the reliability in some special circumstance.In view of the special requirements of packaging process for double-sided cooling IGBT module,a mathematical model of the soldering process about the Three-dimensional structure of double-sided cooling IGBT module has been built,and the soldering process has been simulated by finite element software.Meanwhile,reflow curve of soldering the Three-dimensional structure of double-sided cooling IGBT module has been determined,and the soldering process has been optimized.Results show that the void rate in each layer of the structure is less than 3%.The optimized parameters of the progress meet the requirement of packaging the Three-dimensional structure of double-sided cooling IGBT module.

关键词： Packaging Process optimization Double-sided cooling IGBT module FEM

作者: Chunlei Wang Libing Zheng Li Han Huachao Fang Ju Xu

作者单位: Chinese Academy of Sciences Beijing Engineering Laboratory of Electrical Drive System & Power Electr Chinese Academy of Sciences Beijing Engineering Laboratory of Electrical Drive System & Power Electr

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 626-629

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）