Homogenization Schemes for TSV Interposer Packages

摘要：

　　In 3D through-silicon-via(TSV)interposer package,there are large numbers of micro bumps and micro solder balls,the sizes of the entities in the package having a difference of 3 orders of magnitude.This multi-scale structure brings difficulties to establish the finite element model for analyzing the thermal fatigue life of board-level solder joint.Homogenization method is adopted to avoid these difficulties in this work.The micro bump/underfill layer between the chip and TSV interposer is replaced by the homogenous material layer with equivalent material parameters determined by homogenization method.Four different homogenization schemes are proposed to investigate the thermal fatigue life of the board-level solder joint,and their results are compared.It suggests that the micro bump/underfill layer between the chip and TSV interposer can be replaced by the corresponding underfill material layer in the finite element analysis of solder joint fatigue life.

关键词： TSV interposer Multi-scale structure Homogenization method Finite element modeling Thermal fatigue life

作者: BIE Xiaorui QIN Fei SHEN Ying CHEN Si

作者单位: College of Mechanical Engineering and Applied Electronics Technology Beijing University of Technology Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 698-702

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）