Investigation of warpage induced reliability of a system in package in assembly process

摘要：

　　The power system in package(SIP)includes multiple chips such as power IGBT,diodes and IC controllers.With more chips encapsulated in one single package,the silicon die crack failure is becoming more and more challenging.In this paper,a leadframe based power SIP package is investigated.The warpage induced reliability in assembly process is studied.The initial leadframe pad warpage will induce high tensile stress in silicon die during clamping process.A 3D FEA model for the assembly clamping process is developed.Parametric modeling DoE is carried out to simulate the impact of different leadframe warpage shape(concave and convex),different lead frame pad warpages,different die sizes,different leadframe thickness and different BLTs.

关键词： System in package (SIP) lead frame warpage aseembly clamping FEA

作者: Qiuxiao Qian Yong Liu

作者单位: Package development Fairchild semiconductor(Suzhou)Co.,Ltd.Suzhou,Jiangsu,China Package development Fairchild semiconductor Corp.South Portland,USA

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 718-723

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）