The Use of Buried Technology In Microsystem Packaging Achieves The New Type of Electronic Band Gap

摘要：

　　novel two-dimensional EBG is put forward to suppress the simultaneous switching noise of electronic systems,Based on the inductance enhanced by the development of the micro system substrate embedded technology in recent years in the longlinemetal between adjacent unit cell,the novel two-dimensional EBG structure is achieved by the units lattice structure,which is made of the connection of a square metal and two metal serpentine lines.Simulation results show that the stopband bandwidth of new EBG structure labeling on capacitor is 0~8GHz(S21≤-15dB)in the same parameters EBG classic.

关键词： simultaneously switching noise(SSN) electromagnetic band gap(EBG) Electromagnetic compatibility(EMC)

作者: Wang liuping ShangGuanDong kai Cao liqiang Liu Yuan

作者单位: Institute of Microelectronics Chinese Academy of Sciences Beijing,China;National Center for Advanced Packaging Wuxi,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 749-752

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）