Electromagnetic Noise Coupling Analysis of TSV Array by using Cylindrical Mode Expansion Method

摘要：

　　A semi-analytic approach for the electromagnetic analysis of large numbers of Through silicon vias(TSV)is presented in this paper.The method is based on cylindrical mode expansion method.The scattering and multi reflection effects between the vertical cylindrical vias are considered by expanding the electromagnetic waves surrounding the vias by cylindrical waves.As the method fully captured the physical mechanism of the wave interaction between multiple vias,it can give a high accuracy and fast solution.Based on this method,the effect of the shielding TSVs for the reduction of electromagnetic interference is efficiently analyzed.

关键词： Through silicon vias (TSV) cylindrical mode expansion electromagnetic interference analysis

作者: Jun Li Hui-Chun Yu Xing-Yun Luo Xiao-Bo Huang Xing-Chang Wei Er-Ping Li

作者单位: Department of Information Science and Electronic Engineering Zhejiang University Hangzhou,China Huawei Technologies Co.,Ltd.,Shenzhen,China Cyber Innovation Joint Research Center Zhejiang University Hangzhou,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 753-756

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）