A flexible module design with LED chips based on the PET-copper foils

摘要：

　　The study focus on the process of metal electroplating on copper substrate to assemble LED chips and molding PET-copper foil to implement a flexible module with LED chips.The process can be divided into two parts,-assembling process and molding process.The LEDs are integrated on copper foil which can deal with the heat dissipation problem effectively.The metal electroplating on copper circuitry can achieve a soldered bonding to LED chips.The flexible layers of polyethylene terephthalate(PET)-copper foil are formed by two approaches-hot lamination and transfer molding.The thickness of PET-copper foil is an important parameter to the thermal design.A finite model is developed to study the effects of heat dissipation at different thickness of PET-copper foils.The results show that the flexible have a good thermal property with the thickness of PET-copper foil from 450um to 650um.Finally,a flexible model is simulated at temperature distribution with 5× 5 LEDs.

关键词： Metal electroplating Hot lamination FAM Finite element analysis Molding process

作者: Yun Chao Chen Miao Cai Hong Liang Jia D.G.Yang

作者单位: School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 757-761

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）