Study on Encapsulation Reliability

摘要：

　　Interface delamination is one major reliability problem that may lead to multi-material structures products failure in microsystems package.To ensure the package reliability and to provide guidelines for package design and manufacture,a series of experiments are designed to study the adhesive strength between substrate and molding compound(MC)through charging molding parameters.On the other hand,the adhesive strength,disposed by Moisture sensitivity level 3(MSL3)and reflowed three times at 260 centigrade,is investigated.Finally,some details related with package design and manufacture are given out for reference.

关键词： delamination adhesive strength molding parameters molding compound

作者: Peng DING Renhui LIU Yu CHEN Guanqiang SONG Guanhua LI

作者单位: Shennan Circuits Co.Ltd. Institute of Microelectronics,Tsinghua University

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 792-795

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）