Study on the influencing factors of thermal spreading resistance of HP-LED package

摘要：

　　The optical performance and reliability of High power light emitting diode(HP-LED)devices can be affected by the junction temperature,while thermal resistance is one of the main factors which influence the p-n junction temperature,especially for the thermal spreading resistance.So,Thermal analysis was conducted by differential structure functions combining with finite element analysis and calculation of thermal spreading resistance of HP-LED devices.The results show that thermal spreading resistance plays an important role on total thermal resistance of LED devices.The thermal spreading resistance shows a declined and then increased trend with the increase of substrate thickness; the contact area between the heating source and substrate is the main factor which influences thermal spreading resistance; It is beneficial to decrease the thermal spreading resistance when contact area ratio be increased.Thermal-convection resistance becomes the main factor that influences total thermal resistance of HP-LED devices with the changing of substrate bottom area,while the influence of thermal spreading resistance is weak.The eccentric distance between chip and substrate plays a distinct impact on thermal spreading resistance and junction temperature.The results of finite element simulation are in good agreement with calculation of thermal spreading resistance.

关键词： HP-LED thermal spreading resistance substrate thickness contact area ratio eccentric distance

作者: Jinlong Zhang Luqiao Yin Peng Song Yang Bai Jianhua Zhang

作者单位: School of Mechatronics and Automation,Shanghai University;Key Laboratories of Advanced Display and S Key Laboratories of Advanced Display and System Applications(Shanghai University),Ministry of Educat

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 806-810

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）