Microwave Multichip Module Tridimensional Assembly Technology Based on LTCC

摘要：

　　With the evolution of microwave substrate,microwave multichip modules are developing towards multilayer.Combined with SMT,high-precision chip assembly,circuit connection,anti-influence partition soldering,module integration technology and so on,those multilayer products constructed by utilizing LTCC technology are attractive candidates to satisfy the demand for telecommunication systems with miniaturized size,intergrated structure and light weight.

关键词： multichip module LTCC tridimensional assembly

作者: T.Zhang

作者单位: Aerospace Electronics Manufacturing Center Academy of Space Electronic Information Technology Xian,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 811-814

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）