Simulation Study of a Novel TSV Structure

摘要：

　　A novel TSV structure,formed by two semi-cylinders combining with a quadrangular is proposed and analyzed in this paper.This novel structure can enhance the density of TSV array without significantly decreasing transmission performance and reducing impedance mismatch in TSV-RDL transmission line or depressing the signal crosstalk.Effects of design parameters,such as the side length of quadrangular and the connection angle between TSV and the Redistribution Layer(RDL)are investigated and concluded by a 3D electromagnetic solver.Performance comparison between the novel TSV structure and the traditional one is also provided by simulation.The simulation results show that the novel TSV structure has excellent performance in some respects and can be used as a good substitution of traditional TSV when the TSV array density needs to be increased or the space for processing TSV is limited.

关键词： through silicon via(TSV) three dimensional system in package(3D SIP) 3D Modeling signal propagation loss

作者: Zhensong Li Min Miao Qinghai Li Dacheng Yang

作者单位: School of Information and Communication Engineering Beijing University of Posts and Telecommunicatio Institute of Information Microsystem Beijing Information Science and Technology University Beijing,C School of Information and Communication Engineering Beijing University of Posts and Telecommunicatio

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 829-832

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）