Signal Integrity Analysis of a High-Performance Processor Package with Silicon Interposer

摘要：

　　This paper presents signal integrity analysis of a high-performance processor package with silicon interposer.Thediewas attached on the top side of the siliconinterposer with through silicon vias(TSVs),and theinterposer was connected to the organic substrate.The signal transmission path of this package consists of two redistribution layers(RDLs),TSVson interposer,and wirings on the substrate.The detailed signal integrity analysis with 3D full-wave electromagnetic method and equivalent circuit method are presented to verify the signaltransmission characteristics of the system.The co-simulation of this 2.5D package including silicon interposer and organic substrate is also presented in this paper.

关键词： signal integrityanalysis electrical simulation transmissioncharacteristics silicon interposer through silicon vias

作者: Xiaoli Ren Cheng Pang Feng Jiang Zheng Qin Kai Xue Haiyan Liu Daquan Yu

作者单位: National Center for Advanced Packaging,Wuxi,214315,PR China National Center for Advanced Packaging,Wuxi,214315,PR China;Institute of Microelectronics,Chinese Ac Institute of Microelectronics,Chinese Academy of Sciences,Beijing,100029,PR China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 833-837

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）