Power QFN Tiger Device Down Bond Bond-ability Study

摘要：

　　Power QFN Tiger device failed the down bond open on TC500 or application.Failure analysis verified that it was caused by down bond delamination.Finite Element Analysis modeling was established to analyze the Tiger down bond stress and find out a new position with relative less stress impact as down bond end point.Meanwhile,new bonding model with security loop was applied to down bond to improve the bondability and passed all reliability test.

关键词： Power QFN Down bond Heel broken Delamination

作者: Hanmin Zhang M.Hu B.G Yin Q.C He D.H Ye Sonder Wang

作者单位: School of Electronic Information Engineering,Tianjin University No.92,Weijin Nan Road,Nankai Distric School of Electronic Information Engineering,Tianjin University No.92,Weijin Nan Road,Nankai Distric Freescale Semiconductor(China)Ltd.No.15,Xinghua Avenue,Xiqing Economic Development Area,Tianjin,Chin

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 838-841

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）