Strain field simulation of transferring process on large wafers

摘要：

　　Wafer transferring process is often used in the semiconductor packaging equipment.Wafer transferring system is an essential part in the IC equipment.Smooth and efficiency are the design requirement of wafer transferring.As the rising of smart phones and tablet PCs,thin wafer is increasingly demanding.Large and thin wafer is susceptible to damage because of gravity during transmission,which greatly affect the efficiency and reliability of IC package.To get small deformation of the wafer,this paper analyzes the material parameters of the wafer,and simulates numerically the wafer deformation of different thicknesses and contact methods.Based on supporting points transmission method,the relationship between the distribution of points and wafer deformation is studied.Aiming at the minimal deformation,the distribution of supporting points is determined by optimal design method.

关键词： large wafer transferring wafer deformation strain field simulation finite element analysis

作者: Tang Liang Ye Lezhi

作者单位: The 45th Research Institute of CETC Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 878-880

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）