Effects of Electromigration on the Creep of Sn0.3Ag0.7Cu Solder Joint
For real solder joints used in electronic devices,EM and creep may be two relevant reliability problems because solder joints usually serves under a combination of current stressing,elevated temperatures,and mechanical loading conditions.Especially when the size of solder joints scales down and current density escalates,EM-induced microstructure change should have certain impact on creep behavior.In this study,we analyzed and discussed how EM influenced the creep behavior of lead-free solder joint from the perspective of EM-induced IMCs change.Behaviors of both interfacial and matrix IMCs were observed and attempt to reveal the roles they played in the failure of real lead-free solder joint.From this study we can conclude that: during EM,grain size of interfacial IMCs at both sides was increased,and the size at anode side was much larger.The shape of interfacial IMCs was changed from scallop shape to hexagonal prism.Besides,there were many Cu6Sn5 migrated into solder matrix.During creep,pre-EM process alleviated deformation of solder matrix and brought about brittle fracture of a solder joint.
electromigration creep interfacial IMCs Matrix IMCs
Yong Zuo Limin Ma Fu Guo Lei Qiao Yutian Shu Jing Han
College of Materials Science and Engineering Beijing University of Technology Beijing,the Peoples Republic of China
国际会议
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)
成都
英文
898-901
2014-08-12（万方平台首次上网日期，不代表论文的发表时间）