Optimization of Lead-free Wave Soldering Process for Inverter Air-conditioner Motherboard by DOE
The lead-free wave soldering process of inverter air conditioner motherboard was studied by the method of design of experimental(DOE),and the multiple regression equations of bridging defects corresponding with experimental impact factors were obtained through regression analysis.Results showed that the significance order of experimental factors influencing on “bridging was as follows: flux flow>orbital inclination angle>spray height> dip tin time> spray speed >preheating temperature.The final optimized combination of process parameters was got: flux flow was 40 ml/min,spray speed was 150 mm/s,spray height was 58 mm,preheating temperature was 100℃,orbital inclination angle was 6.2 °,and dip tin time was 5 s.Repetitive experimental verification was conducted,and it showed that the defect rate of lead-free wave soldering could be significantly reduced and controlled within 1,000 PPM using the optimized combination of parameters.
inverter air conditioner lead-free wave soldering DOE bridging optimization
Xiaojian Liu Ling Wang
State Key Laboratory of Advanced Welding & Joining,School of Materials Science and Engineering,Harbi China Electric Apparatus Research Institute Co.,Ltd.,CEI Guangzhou,China
国际会议
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)
成都
英文
917-922
2014-08-12（万方平台首次上网日期，不代表论文的发表时间）