The Simulation Analysis for the Correlation between Failure of BGA Solder Joints and the Loading Modes

摘要：

　　In this paper,three-dimensional finite element model of BGA package was used to be simulated lead-free solder.Sn-3.0Ag-0.5Cu was used as the material of solder joints array in the interconnection structure of BGA.The constitutive equation of power exponent law was applied to represent the stress-strain behavior of lead-free solder joints.The dangerous area of failure in the model was located.The change law of equivalent of stress-time and equivalent of plastic strain-time,and the correlation between failure and the loading modes of solder joints were studied.The results show that: the failure location of solder joints under different loading modes is the same.The position of stress concentration located at the lower left IMC(Intermetallic Compounds),the maximum equivalent plastic strain area located at the upper right solder neck.The residual stress of the lower left IMC under cycle loading unloading is the largest so the crack is most likely to happen.The equivalent plastic strain of the upper right solder neck under step cycle loading unloading is the largest and the ductile failure is most likely to happen.So cycle loading unloading mode and step loading unloading mode should be avoided at practical work.

关键词： finite element analysis loading modes stress-stain failure

作者: Wang Lifeng He Bing Yu Yangyang

作者单位: Harbin University of Science and Technology Material college in HUST No.4 Linyuan Road XiangFang Zone Harbin,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 933-936

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）