The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows

摘要：

　　The appearance of IMCs on the Sn/Cu interface plays an important role in the joint reliability.Their growth behavior during solidification of multiple reflows was investigated.Compressed air was employed to blow away the residual liquid solder immediately after heating preservation so that the morphology corresponding to heating preservation would remain unaltered; and then by compared they with samples experienced air cooling,the growth of interfacial Cu6Sn5 grains could be investigated separately.The morphology of Cu6Sn5 grains remained a scallop-type during heating preservations of multiple reflows and they always converted to prism-type after air cooling.The dissolution and precipitation of Cu in liquid Sn with the temperature fluctuations should be responsible to the transformation.Moreover,scalloped Cu6Sn5 grains appeared at heating preservation became larger with the increasing number of reflows due to the ripening reaction.Their growth in dimension induced a change in appearance of those prismatic Cu6Sn5 grains formed on them.Shorter but larger main facets formed on those prismatic Cu6Sn5 grains with the increasing number of reflows.

关键词： intermetallic compounds (IMC) morphology growth behavior Cu6Sn5 solidification multiple reflows

作者: Shuang Li Yao Du Lin Qu Anil Kunwar Junhao Sun Jiahui Liu Ning Zhao Mingliang Huang Haitao Ma

作者单位: School of Materials Science & Engineering Dalian University of Technology Dalian,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 937-939

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）