Numerical simulation and analysis on thermal coupling effect of MCM packaging
Simplified MCM packaging models with different chip numbers and different chip distribution were built up.The paper uses numerical simulation method to study the thermal field and thermal stress distribution of package with different chip number,chip arrangement,heat convention coefficient and different substrate material.Multi-chips heat resistance also been calculated,but was affected by thermal coupling much and led to the inaccurate results.By simulation result,heat convection coefficient is the most critical factor that affects packaging temperature; change the distribution mode can improve the packaging stability; among the different substrate materials,SiCp/Al is considered as a good packaging material in its proper mechanical and thermal property.From this paper,general heat and stress distribution and their main influence factor of MCM packaging will be obtained,along with their influence mechanism.This paper will have big significance on MCM packagings optimization design and improvement of working stability.
MCM packaging thermal analysis thermal coupling numerical simulation
WANG Kaikun GAO Qi GE Zhipeng
School of Materials Science and Engineering University of Science and Technology Beijing Beijing,100083,China
国际会议
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)
成都
英文
967-970
2014-08-12（万方平台首次上网日期，不代表论文的发表时间）