Effect of Temperature Cycling on Reliability of Flip Chip Solder Joint

摘要：

　　This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device,the UBM structure for Ti/Cu/Cu,substrate using alumina ceramic substrate.Testing every 100 cycles on the flip chip samples are electrically connected test,failure analysis of flip chip bonding specimen failure.The test results show that,the underfill can effectively improve the thermal fatigue life of solder joints.The content of PbSn bumps in Sn has significant influence on the solder joint reliability.

关键词： Flip chip Reliability High temperature cycle Underfill

作者: Xueming Jiang Pengrong Lin Yuezhong Song Yingzhuo Huang Binhao Lian Quanbin Yao

作者单位: Beijing Microelectronics Technology Institute Beijing Aerospace System Engineering Research Institute Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 989-991

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）