A Simulation of Intelligent Power Module Under Power Cycling Condition

摘要：

　　this paper focuses on the performance of IPM(Intelligent Power Module)under power cycling test which is simulated by a FEA(Finite Element Analysis)method.Through the method of control variables some key parameters about the modules thermal and structure properties can be obtained.The key parameters in the calculation include power dissipation of silicon chip,cycle period,different materials of ceramic substrate and solder layer thickness.A series of factors are adopted in the simulation to evaluate the influence of power cycling test on IPM.The disciplinary conclusion can be a suggestion for package design.

关键词： IPM Power cycling FEA

作者: Yong Wang Wen Zhao Ming Li Ming Chen Liming Gao

作者单位: School of Material Science and Engineering Shanghai Jiao Tong University Shanghai,China Power Device Group Shanghai Belling Corp.Ltd.Shanghai,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1015-1020

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）