Morphology, Kinetics and service reliability of Cu6Sn5 texture formed on Sn/Cu interface

摘要：

　　we proposed a hexagonal-rod growth behavior to describe the growth mechanism of the intermetallic Cu6Sn5 phase inside the liquid Sn-base solder.We found that the interfacial Cu6Sn5 phase formed on Sn/Cu joint interface also has the similar characteristics in terms of the shapes and surface textures.Based on this anisotropic growth behavior,a supply-controlled kinetic model of Cu6Sn5 phase was established.In addition,this study could deepen our understanding of the solid-state phase transformation in Cu6Sn5,and also be of great significance in the interfacial reliability of solder interconnections.

关键词： Cu6Sn5 anisotropic growth kinetics hexagonal-rod shape service reliability

作者: Zhihao Zhang Huijun Cao Yong Xiao Mingyu Li

作者单位: Shenzhen Graduate School Harbin Institute of Technology Shenzhen,China State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Harbin,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1056-1059

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）