Warpage and Stress Optimization of Wafer-level Package of MEMS with Glass Frit Bonding

摘要：

　　Warpage issue of wafer level package(WLP)has caught the attention of WLP industry.This paper aims at the warpage characteristics and optimization of the WLP(consisting of silicon MEMS wafer and silicon cover wafer)with glass frit bonding.Finite-element method(FEM)was used to study the warpage and stress optimization of the Si-Si bonding WLP.Some factors which affect WLP warpage,such as CTE(coefficient of thermal expansion)and Youngs modulus of glass frit,ring thickness & width of glass frit and bonding temperature etc.were optimized.The stress of WLP was also calculated and the reliability level of the MEMS device was estimated.It turned out that CTE and Young modulus of glass frit are the key parameters for decreasing WLP warpage and stress and promoting the MEMS WLP.Ring width of glass frit and the thickness of silicon cover plate wafer have little impacts on WLP stress and warpage.With the optimized parameters taken into account,the stress in MEMS WLP falls down.Those optimization results have been put into actual WLP manufacture.

关键词： warpage stress optimization glass frit wafer level package (WLP) finite-element method (FEM) MOS (multi-beam optical sensor) deformation measurement micro electro mechanical systems (MEMS)

作者: Gaowei Xu Chunsheng Zhu Jiaotuo Ye Heng Li Wei Gai Le Luo

作者单位: State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1075-1079

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）