Thermo-mechanical Reliability of 3D package under different thermal cycling

摘要：

　　In this paper,thermo-mechanical reliability of a three-dimensional(3D)package based on through-silicon-via(TSV)under different thermal cycling was investigated with finite element method.A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill.It was found that the fatigue live of solder joints was extended by using of unerfill.The influence of TSV arrangement on the fatigue life of solder was compared.

关键词： three-dimensional package finite element solder joint fatigue life

作者: Tianbao Lan Fei Su

作者单位: Beihang University,Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1138-1141

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）