Effect of Package Thermal Warpage for POP Assembling Technique

摘要：

　　POP stacking technique satisfied the demands of miniaturization,function integration and higher memory space for mobile communication products.However,the warpage of POP package during the soldering procedure will bring the unfavorable effects to quality and reliability of the products.The paper introduces the POP assembling procedure,aims to test and results analysis the effect of package warpage for POP assembling technique,summarizes the measurements for minimizing the package warpage.

关键词： package on package (POP) warpage shadow moire (Head in Pillow)HIP

作者: Yabing Zou Zhenfeng Zhao

作者单位: Reliability Research and Analysis Center China Ceprei Laboratory Guangzhou,China The Air Force Military Representative Office in Guangzhou Shenzhen,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1142-1145

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）