The Morphology Change of SnAgCu Solder Under Current Stressing

摘要：

　　Special specimen was designed to study the morphology change of SnAgCu solder under the influence of electromigration(EM)alone.High current stressing was applied to the specimens so that EM of solder would happen at both room and high temperatures.The interfacial crack at cathode is the main failure mode,although the positions of crack maybe different under different temperatures.localized hilocks were observed at anode and central part of solder at room temperature.But at high temperature,localized hillock was not observed,instead,the soldersurge toward anode,whats more, it is found that the morphology of Cu3Sn changes from layer to scallop so that it loose its function as a barrier Cu migration.Evolution of the temperature field and plasticity deformation of solder during current stressing were observed,which can be served as basis for damage evolution of solder.

关键词： solder joint electromigration morphology change reliability

作者: Zheng Zhang Yuan Wang Fei Su

作者单位: School of Aeronautic Science and Engineering Beihang University,Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1155-1158

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）