Different diffusion behavior of Cu、Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during Liquid-Solid electromigration

摘要：

　　Different diffusion behavior of Cu 、Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration(L-S EM)were investigated under a current density of 5.0 × 103 A/cm2 at 230 ℃.When Cu atoms were under downwind diffusion,L-S EM enhanced the cross-solder diffusion of Cu atoms to the opposite Ni side compared with the liquid-solid reaction case,resulting in the formation of interfacial Cu5Zn8 at Ni/Sn-Zn interface,and its thickness increased at the beginning and then decreased.For the Ni atoms,L-S EM significantly enhanced the diffusion of Ni atoms to the Cu side when Ni atoms were under downwind diffusion,resulting in the formation of a large amount of(Ni,Cu)3(Sn,Zn)4 at the Cu side.Under the combined effect of chemical potential gradient and electronic wind force,the Zn atoms with positive effective charge number would directional diffuse towards Cu side under both downwind and upwind diffusion conditions,as a result,the interfacial Cu5Zn8 formed at the Cu side,and its thickness continuously increased.

关键词： Cu/Sn-9Zn/Ni Electromigration Chemical potential gradient Interfacial reaction

作者: Q.Zhou Y.Zhou X.Qin X.J.Wang M.L.Huang

作者单位: Research laboratory of process and mechanical engineering technology,Space Star Technology Co.,Ltd,B Electronic Packaging Materials Laboratory,School of Materials Science & Engineering,Dalian Universit

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1164-1168

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）