Investigation on Reliability and Failure Analysis of Plastic Encapsulated Microelectronics

摘要：

　　Plastic encapsulated microelectronics used in a large variety of applications offer significant advantages in terms of cost,size,weight and product variety.However,PEMs are non-hermetic package and the plastic mold materials are inherently hygroscopic and absorptive,so the PEMs are permeability to moisture.Furthermore,the mismatch of coefficient of thermal expansion between the mould compound and various interfaces makes the PEMs more sensitive to thermomechanical stresses.In this paper the reliability issues of PEMs are investigated.And the related failure modes and failure mechanisms are summarized and illustrated by typical failure analysis cases.In the end,some precautions for minimize such failures are presented.

关键词： plastic encapsulated microcircuits (PEMs) reliability corrosion failure analysis popcorning

作者: Huiwei Wu Shengzong He Liyuan Liu Xianjun Kuang Dengyun Lei Haijun Li

作者单位: Reliability Analysis and Research Centre China Electronics Product Reliability and Environmental Tes Lab of SoC,Department of Microelectronics Peking University Beijing,China Military Representative Office of the air Force Stationed in the Area of Guangzhou Guangzhou,P.R.Chi

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1169-1172

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）