Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects

摘要：

　　The effect of electromigration(EM)on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects was investigated under a current density of 5×103 A/cm2 at 150 ℃.After aging and EM,the thickness of interfacial IMCs increased.The IMC layer at the cathode side was thicker than that at the anode side for the samples after EM.Compared with the as-soldered interconnects,the tensile strength of those after both aging and EM significantly decreased.Solder joints undergoing EM deteriorated more severely and their strength decreased more than the aging cases.As for the as-soldered samples,fracture occurred at the IMC/solder interface,while with increasing aging time,the fracture position changed from at the interface to in the bulk solder.With increasing EM time,the tensile fracture tended to occur at the cathode interface,since voids formed at the cathode side after EM.

关键词： Cu/Sn-9Zn/Cu interconnect electromigration tensile strength intermetallic compound fracture

作者: Mingliang Huang Fei Zhang Fan Yang Ning Zhao

作者单位: Laboratory of Electronic Packaging Materials School of Materials Science & Engineering,Dalian University of Technology Dalian,China 116024

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1190-1193

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）