A novel design of heatsink-less LED base fluorescent lamp retrofit
A new “heatsink-less LED based T8 retrofit design is proposed in this study.The lamp consisted of light emitting elements directly attached on a flexible substrate.The substrate is mount on to the inner wall of a full cylindrical glass tube.The design is intended to simplify the lamp construction.However,since the metal-based heat sink is eliminated,the thermal design is a concern.Finite element analysis was performed to optimize the thermal design by varying metal line routing on the flexible substrate,and the glass tube structure.The optimal result shows that the junction temperatures of the LED inside the lamp is about 52℃ driven under nominal current.The simulation result is comparable with the experimental measurement.In addition,Darveauxs fatigue prediction model was implemented to calculate the thermal cycles for crack initiation and propagation,based on the inelastic strain energy density accumulated per cycle during thermal cycling.The details of the design and the optimization strategy is discussed.
LED heat dissipation flexible substrate strain based fatigue life prediction
Jia Zhao Yan Liu Hongyu Tang Stanley Y Y Leung Cadmus C A Yuan G Q Zhang
State Key Laboratory of Solid-State Lighting,Changzhou,Jiangsu,213161,China State Key Laboratory of Solid-State Lighting,Haidian,Beijing,100086,China;Research and Development C Delft Institute of Microsystems and Nanoelectronics(Dimes),Delft University of Technology,Delft,the
国际会议
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)
成都
英文
1202-1207
2014-08-12（万方平台首次上网日期，不代表论文的发表时间）