Microstructure and Properties of Sn2.5AgO.7CuO.IRE Lead-Free Soldering Joints with ultrasonic Assisted

摘要：

　　Sn2.5AgO.7CuO.1RE/Cu solder joints were obtained with ultrasonic vibration assisted.Microstructure and properties of the joints were studied.Experimental results show that reliable soldering of Sn2.5AgO.7CuO.1RE/Cu can be achieved under condition of ultrasonic power of 88 W and low-halogen flux.The maximum shear strength of 26.0 MPa is obtained from the joint soldered at ultrasonic vibration time of 60 s,which increased by 35%.Compared with that of the solder joint obtained without external energy assisted,the application of ultrasonic vibration during soldering can decrease thickness and roughness of the interfacial Cu6Sn5 intermetallic compound,and the fracture mechanisms of the solder joints transforms from brittle fracture to mixed fracture,which is dominated as ductile fracture.

关键词： Ultrasonic wave Lead-free solder joint Microstructure Property

作者: Yu-jie Liu Ke-Ke Zhang Xiao-jiao Zhang Kai Zhao Ran-feng Qiu Hong-xin Shi

作者单位: School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023 China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1233-1236

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）