Technique of multi-temperature Stepped Welding in Microwave Modules

摘要：

　　There are many complicated assemble kinds of RF PCB and RF part and RF component and Input/Output(I/O)in Microwave Modules,because of especial request to RF grounding soldering and cooling,traditional assemble mode by bolt fixing in Microwave Modules is not suffice high frequency circuit.In allusion to this need in work applications,the technique of multitemperature Stepped Welding is expounded in this paper.It introduces the principle of selecting different temperature solder paste and preparative work ahead of Soldering in multitemperature Gradient.It depicts process of multi-temperature Stepped Welding and demonstrates advantage of multitemperature Stepped Welding.It proves that multi-temperature Stepped Welding is very efficacious way to ensure Microwave circuit capability by using different temperature solder paste.

关键词： solder paste temperature gradient soldering curve

作者: Hongyuan Luo Chengde Cai Hailun Li

作者单位: Department of Process Technology Sichuan Jiuzhou Electric Group CO.LTD Mianyang,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1370-1374

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）