Reactive spreading and dewetting of liquid SnPb solder on Cu thin films

摘要：

　　The SnPb solder ball was reflowed on the Cu film in a flow of reducing gas,and the reactive spreading process was in situ recorded by a CCD camera.On the thicker Cu films,it was observed that dewetting did not happen even if the Cu6Sn5 intermetallic compounds spalled into the liquid solder.However,on the thinner Cu films,dewetting would occur when the liquid SnPb solder consμmed the underneath Cu film.It was concluded that the thickness of Cu film played an important role in determing the dewetting behavior.We set up a simplified model to explain this phenomenon,which was also supported by experiments.

关键词： Cu film wetting tip dewettig solder spreading

作者: W.Liu P.Jin S.D.Zhang

作者单位: Shenzhen Graduate School of Peking University Shenzhen,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1442-1445

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）