会议专题

Thermal resistance analysis of high power LED module under power cycling test

  High junction temperature is always a big concern for the LED products since it is generally associated with the products reliability.Therefore,the way to maintain an adequate cooling capacity is extremely important for LED module.It is no doubt that thermal resistance is one of critical indicators restricting the heat dissipation.In this work,one LED module with ceramic carrier is submitted to power cycling test,and T3ster transient thermal analysis tester is employed to measure the electrical and thermal properties of LED module.During the power cycling testing,the temperature and thermal resistance are monitored,with a goal to analyze the thermal resistance rise at different layer inside LED module.The result indicates the total thermal resistance of the LED module climbs dramatically after power cycling test,in which the increased thermal resistance of the solder joint layer shows a crucial contribution obviously.Based on the experimental investigation,the increased thermal resistance of the solder joint is key reason that leads to the increasing junction temperature of LED package.Its concluded the solder joint layer should be regarded as a key role on reducing the total thermal resistance of LED module.The material and structure of solder joint layer should be designated based on the thermal resistance performance during the long time operating in order to enhance the reliability of LED module.

LED module thermal resistance solder joint power cycling test

Hao Huang Miao Cai Kunmiao Tian Yunchao Chen Hongliang Jia Daoguo Yang

School of Mechanical and Electrical Engineering Guilin University of Electronic Technology Guilin,China

国际会议

The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

成都

英文

1446-1449

2014-08-12(万方平台首次上网日期,不代表论文的发表时间)